LTCC Low Temperature Co-fired Ceramic, Thick film printing,  Ceramics substrates and LTCC ceramics parts.

Minicaps     LTCC- Low Temperature Co-fired CeramicMade in USA  

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LTCC

LTCC  Low Temperature Co-fired Ceramic

LTCC Design Rules

Low Temperature Co-fired Ceramic LTCC in 3D 

Machining ceramics parts LTCC material

Cooling tunnels for heat managements

Capacitors

SLCC Single Layer Ceramic Chip Capacitors

MLCC  Multi Layer Ceramic Chip Capacitors

HVCC High Voltage Ceramic Capacitors

 

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Minicaps introducing a new ceramic substrates with Mini cooling tunnels

                        

  LTCC ceramic substrate with Mini cooling tunnels for heat managements

Minicaps offers new ceramic substrates with Mini cooling tunnels. This is advance ceramic substrate with combinations of LTCC (Low Temperature Co-fired Ceramic) or Thick film printing and ceramic substrates, produces high tech temperature controlled package. The advantage of the Mini cooling tunnels is dissipate heat from ceramic substrate next to critical components (with or with out air enforcing by Mini-fan)

                                                

                                       LTCC - Mini Cooling Tunnel  (X60)  

      The above tunnel is before applying conductive coating of silver.  The above substrate thickness is 0.040".


Minicaps offers prototyping and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates

 

Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multi-layer ceramic chip capacitors (MLCC), Single layer ceramic chip capacitors (SLCC), Low Temperature Co-fired Ceramic (LTCC) Chip Resistors, Multilayer substrate & packaging technology for a wide range of applications. The Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of applications: wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, and other applications.

 LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multi layer ceramic dielectric tape and screen printing of conductors materials (Silver or Gold).

Minicaps offers prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), Thick film printing, ceramics substrates, LTCC Ceramic Chip Capacitors, LTCC Multilayer ceramic chip capacitors (MLCC),  Single layer ceramic chip capacitors (SLCC), Low Temperature Cofired Ceramic (LTCC) Chip Resistors. For LTCC, Thick film printing, chip Capacitors, chip Resistors, or info, please contact Minicaps

ContactHome, LTCC  Low Temperature Co-fired Ceramic, LTCC Design Rules, Low Temperature Co-fired Ceramic LTCC in 3D , Machining ceramics parts LTCC material, Cooling tunnels for heat managements, SLCC Single Layer Ceramic Chip Capacitors, MLCC  Multi Layer Ceramic Chip Capacitors, HVCC High Voltage Ceramic Capacitors, Link to LED Products, Link to LTCClab, Link to LEDRunlight, Links page

 

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