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LTCC
LTCC Low Temperature Co-fired Ceramic
Cooling tunnels for heat managements
LTCC- ceramic chip package (The Box)
Machining ceramic parts, LTCC material
Low Temperature Co-fired Ceramic LTCC in 3D
Minicaps offers prototyping and manufacturing services multilayer substrate & packaging, ceramic Box technology for a wide range of applications
Top view of ceramic package (Box) made from LTCC substrate and ceramic cover.
Bottom view of ceramic package (Box) made from LTCC substrate and ceramic cover.
Low Temperature Co-fired Ceramic (LTCC) Minicaps offers prototyping and manufacturing services of LTCC (Low Temperature Co-fired Ceramic) multilayer substrate & packaging technology for a wide range of applications. Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of wireless, telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications. Advantages of the LTCC (Low Temperature Co-fired Ceramic) : Cost efficiency for high volumes, High packaging density, Reliability, Integrated and embedded passives component (Capacitors Inductors and Resistors) in the LTCC, good dielectric thickness control, high print resolution of conductors, low K dielectric material. The LTCC (Low Temperature Co-fired Ceramic) is a small PCB (printed circuit board), made from multilayer ceramic dielectric tape and screen printing of conductors material (Silver and Gold) on the green ceramic tape.
Contact Minicaps
E mail sales@minicaps.com for LTCC ltcc@minicaps.com
for Engineering: eng@minicaps.com or for any other info info@minicaps.com
California USA
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